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Press Release: VIA Introduces New VIA Eden Embedded System Platform

 

Posted By Van Smith

Date: December 11, 2001

Lowest power, highest performance, and most scaleable x86 embedded platform for fanless Information and Entertainment PCs & Appliances

Taipei, Taiwan, 11 December 2001, - VIA Technologies, Inc, a leading innovator and developer of core logic chipsets, microprocessors, and multimedia and communications chips, today announced the introduction of the VIA Eden Embedded System Platform, a revolutionary approach to enabling quiet running, small form factor designs.

 

Combining an ultra low power processor with highly integrated North Bridge and South Bridge chipset options, the VIA Eden Platform provides the lowest power, highest performance and most flexible embedded x86 solution available from a single vendor. With its rich integration and exceptional thermal properties, the VIA Eden Platform heralds a new era for connectivity products, including home entertainment devices such as the set top box, game console, personal video recorder and home server, and commercial applications such as the thin client, POS terminal and routers.

 

“The launch of the VIA Eden Embedded System Platform marks an important new milestone in the implementation of the VIA Total Connectivity vision,” commented Wenchi Chen, President and CEO of VIA Technologies, Inc. “It brings to the industry for the first time a truly open and comprehensive x86 embedded multimedia platform based on proven market-leading technology that will drive rapid new product innovation.”   

 

VIA Eden Embedded System Platform Overview

The VIA Eden Platform features a low power, high performance sixth generation processor core combined with a choice of VIA Apollo PLE133 or VIA ProSavage® PN133T North Bridge chips featuring integrated AGP2X/4X graphics and 3D/2D/video acceleration. Also included is the highly integrated VT8231 South Bridge, with a full set of built-in networking, Super I/O, connectivity, and audio features, as well as a wide range of Companion chips that enable the convenient and low cost integration of additional IEEE 1394, USB 2.0, TV-Out, and Ethernet PHY functions.

 

With overall system power consumption levels of just over six watts, the VIA Eden Platform is the industry’s lowest power x86 embedded platform. Market-leading thermal characteristics make the VIA Eden Platform the ideal solution for ergonomic fanless system designs for a variety of innovative low profile, small form factors, and translate into lower energy costs and longer battery life in mobile designs.

 

Featuring a powerful processor core available with native x86 execution, 192KB full speed L1/L2 cache, and MMXÔ and 3DNow!Ô support, the VIA Eden ESP delivers leading edge PC application and Internet performance on an embedded platform and is fully compatible with a complete range of Microsoft® Windows® XP, Windows 9x, Embedded Windows, and Windows CE operating systems as well as all the leading versions of Linux. The VIA Eden Platform’s multimedia performance is further enhanced by its integrated APG2X/4X graphics with full 3D/2D/video acceleration, including motion compensation for advanced video applications.  

 

With its rich levels of integration and multiple configuration options, the VIA Eden Platform not only delivers unprecedented system design flexibility on an x86 embedded platform but also speeds up time to market and minimizes product development and manufacturing costs by reducing the number of discrete components. The VIA Eden Platform is covered by a four year product life cycle program, and is supported on a global basis through VIA’s worldwide operations.

 

VIA Eden Embedded System Platform Availability

The VIA Eden Platform VE1400, VE1500, VE2400, and VE2500 models are shipping in volume now; pricing information is available on request. The VIA Eden Platform VE1600 and VIA Eden ESP VE2600 models will be available in Q1, 2002.

 

 

About VIA Technologies, Inc.

VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia and communications chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3™ processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2000. Additional information can be found at www.via.com.tw.

 

 

VIA PR Contacts

 

US:

Dan Havey

International:

Richard Brown

Phone:

1-510-687-4678

Phone:

(886)-2-2218-5452 #6201

Fax:

1-501-423-9170

Fax:

(886)-2-2218-5453

Email:

DanHavey@viatech.com

Email:

RichardBrown@via.com.tw

 

Note to reporters, editors and writers: VIA is written in ALL CAPS.

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